JPH0611531Y2 - 回路基板装置 - Google Patents
回路基板装置Info
- Publication number
- JPH0611531Y2 JPH0611531Y2 JP1988101559U JP10155988U JPH0611531Y2 JP H0611531 Y2 JPH0611531 Y2 JP H0611531Y2 JP 1988101559 U JP1988101559 U JP 1988101559U JP 10155988 U JP10155988 U JP 10155988U JP H0611531 Y2 JPH0611531 Y2 JP H0611531Y2
- Authority
- JP
- Japan
- Prior art keywords
- component mounting
- solder
- land
- circuit board
- board device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 34
- 239000011521 glass Substances 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 230000002265 prevention Effects 0.000 description 5
- 239000006071 cream Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000012447 hatching Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988101559U JPH0611531Y2 (ja) | 1988-07-30 | 1988-07-30 | 回路基板装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988101559U JPH0611531Y2 (ja) | 1988-07-30 | 1988-07-30 | 回路基板装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0224570U JPH0224570U (en]) | 1990-02-19 |
| JPH0611531Y2 true JPH0611531Y2 (ja) | 1994-03-23 |
Family
ID=31330667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988101559U Expired - Lifetime JPH0611531Y2 (ja) | 1988-07-30 | 1988-07-30 | 回路基板装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0611531Y2 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011040480A1 (ja) * | 2009-09-30 | 2011-04-07 | 株式会社村田製作所 | 回路基板 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4978164A (en]) * | 1972-12-04 | 1974-07-27 | ||
| JPS62196376U (en]) * | 1986-06-04 | 1987-12-14 |
-
1988
- 1988-07-30 JP JP1988101559U patent/JPH0611531Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0224570U (en]) | 1990-02-19 |
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